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Exploringthe Thermal Management in IC Substrate PCB


The choice of substrate material greatly influences thermal management. Materials with high thermal conductivity, such as ceramics (alumina, aluminum nitride) and certain types of laminates (metal core PCBs), are preferred for efficient heat dissipation.
These are small plated-through holes in the PCB that extend from the surface to inner layers. They facilitate heat transfer from the IC to the PCB's core, where it can be spread out and dissipated more effectively. Proper placement and design of thermal vias are essential for optimal thermal performance.

Contact info:- https://efpcb.mystrikingly.com/blog/exploringthe-thermal-management-in-ic-substrate-pcb


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Target Prov.: All Provinces
Target City : Guangdong
Last Update : May 04, 2024 10:57 AM
Number of Views: 23
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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2024-05-05 (0.627 sec)