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Submount (Heatspreader), Global Market Size Forecast, Top 17 Players Rank and Market Share


Submount (Heatspreader) Market Summary
According to the new market research report “Global Submount (Heatspreader) Market Report 2024-2030”, published by QYResearch, the global Submount (Heatspreader) market size is projected to reach USD 369.9 million by 2030, at a CAGR of 3.4% during the forecast period.
A submount is used in electronics that provides mechanical support, electrical connections, and thermal management for electronic components such as LEDs, laser diodes, and photodiodes.
Submounts are typically made from materials with high thermal conductivity and low coefficient of thermal expansion to help dissipate heat generated during operation and minimize the risk of warping or cracking. Common materials used for submounts include ceramics, metal, and diamond.
In addition to providing thermal management, submounts also provide electrical connectivity between the electronic component and external circuitry. They often contain wires, pads, or other features to facilitate electrical connections, and their design can be optimized to minimize electrical resistance and improve performance.
Overall, submounts play a critical role in the performance and reliability of electronic components by providing mechanical support, electrical connections, and thermal management.
The global key manufacturers of Submount (Heatspreader) include Kyocera, MARUWA, Vishay, ALMT Corp, Murata, Zhejiang SLH Metal, Xiamen CSMC Semiconductor, GRIMAT Engineering, Hebei Institute of Laser, CITIZEN FINEDEVICE, etc. In 2022, the global top 10 players had a share approximately 75.0% in terms of revenue.

For more information, please contact the following e-mail address:
Email: global@qyresearch.com
Website: https://www.qyresearch.com



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Last Update : Apr 11, 2024 4:03 AM
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Item  Owner  : Emily
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